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Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Shenzhen Aochuan Technology Co., Ltd
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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

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Brand Name : AOK

Model Number : TM300

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 400 ml (200 ml each part)

Payment Terms : T/T

Delivery Time : 13-15 working days

Packaging Details : 50 ml (25 ml each part)/ 400 ml (200 ml each part)/ 20 kg (10 kg each part)

Product Name : Silicone Thermal Conductive Gap Filler With Good insulation For LED

Composition : Ceramic filler + Silicone

Usage Temperature : -40 ℃ ~ 150 ℃

Thermal Resistance : 0.3 (℃-in2/W)0.1mm@50psi

Dielectric Constant : 7.3(@10mhz)

Thermal conductivity : 3.0 W/m.K

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Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

Purchasing information
Packing specification: 300ml Cartridge/1Kg Jar/20KG Pail

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules


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Anti Insulation Thermal Conductive Gap Filler

      

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