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Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

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Shenzhen Aochuan Technology Co., Ltd

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Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Brand Name : AOK

Model Number : TP800

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000 pcs

Payment Terms : T/T

Delivery Time : 13-15 working days

Packaging Details : 400 mm x 200 mm

Product Name : Low Thermal Resistance 8W/MK Pink Silicone Thermal Pad Material For Networking

Composition : Silicone

Thermal conductivity : 8.0±0.5 W/m.K

Color : Pink

Hardness : 55±10(Shore OO)

Flammability : V-0

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Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking

Attribute	Value	Test Method
Composition	Ceramic Filler + Silicone	-
Color	Pink	Visual
Thickness(mm)	0.5~10	astm d374
Density(g/cc)	3.35	ASTM D792
Hardness(shore oo)	55±10	ASTM D2240
Usage Temperature(℃)	-40~150	--
Electrical
Breakdown Voltage(kv/mm)	＞6.0	ASTM D149
Dielectric Constant(@10mhz)	7.2	ASTM D150
Volume Resistivity(Ω.cm)	10¹²	ASTM D257
Flammability	V-0	UL94
Thermal
Thermal conductivity(W/m.K)	8.0±0.5	ASTM D5470

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force

Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Product Tags:

Tasteless Thermal Pad Material

Tasteless IC Thermal Pad Material

Networking IC Thermal Pad

Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking Images

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