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Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Multipurpose Thermal Silicone Pad

Shenzhen Aochuan Technology Co., Ltd
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Multipurpose Thermal Silicone Pad

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Brand Name : AOK

Model Number : TP

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000pcs

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 400mmx200mm

Product Name : Pink Silicone High Thermal Conductive Thermal Pad Material With 8.0w For Cpu

Composition : Silicone

Thermal conductivity : 8.0±0.5(W/m.K)

Color : Pink

Dielectric Constant : 7.2(@10mhz)

Volume Resistivity : 1.0*10^12(Ω.cm)

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Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Purchase information:

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Multipurpose Thermal Silicone Pad


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